Chipone attended the 65th anniversary meeting of Beijing Polytechnic
On the morning of October 18, 2023, the 65th anniversary of the founding of Beijing Polytechnic and the high-quality development forum of high-level skilled universities were successfully held. Yang Tengfei, vice president of Chipone North Packaging and Testing Department, attended the anniversary.
Wang Dapin, Deputy Secretary of the Education Working Committee of the Beijing Municipal Party Committee, Kong Lei, Deputy Secretary of the Working Committee and Director of the Management Committee of the Beijing Economic and Technological Development Zone, He Fengying, Leader of the Discipline Inspection Team of the Beijing Municipal Development and Reform Commission, Zhang Qihong, Secretary of the Party Committee of Beijing Polytechnic, Yao Guangye, Deputy Secretary of the Party Committee and Dean of the University, and other school leaders attended the conference.
Representatives of 7 municipal undergraduate colleges including Beijing University of Technology, North China University of Technology, Beijing Institute of Graphic Communication, 13 vocational colleges inside and outside Beijing, including Beijing Vocational and Technical College of Industry and Tianjin Vocational University, as well as representatives of more than 30 cooperative enterprises such as Beijing Benz Automobile, iFLYTEK (Beijing), and Chipone attended the anniversary.
Yao Guangye, President of Beijing Polytechnic, gave an opening speech
Beijing Polytechnic 65th Anniversary
The integration of enterprises and schools
In order to continue to promote the integration of vocational education, strengthen the integration of enterprises and education, cooperation between enterprises and schools, and promote the coordinated development of industry, education and research, Beijing Yicheng Cooperation and Development Foundation, iFLYTEK (Beijing), Chipone and many other cooperative enterprises and institutions have donated a large amount of teaching equipment and funds to Beijing Polytechnic. Yang Tengfei, vice president of the packaging and testing department of Chipone North, received the donation certificate on behalf of the company.
Yang Tengfei, Vice President of Chipone Packaging and Testing Department (6th from left) Collect the certificate on behalf of the company
At the beginning of November 2022, Chipone and Beijing Polytechnic jointly signed the "Strategic Cooperation Agreement on Jointly Building an Integrated Circuit Design and Testing Pilot Base", and donated industrial-grade testing machines, taping machines and other equipment worth 3.04 million yuan to the school, giving strong support to the training of high-quality professional and skilled talents in the integrated circuit industry.
Since the official operation of the pilot base, the school and the enterprise have given full play to their respective advantages, combined with the experience of display driver chip design and development and high-end technical personnel training, introduced the production line to the campus, provided students with learning and internship opportunities to contact high-end technology production lines, realized the initial training of integrated circuit engineers, and also solved the test capacity needs of enterprises.
Chipone and Beijing Polytechnic jointly built an integrated circuit pilot base
The construction of the pilot base provides an exploration path and development opportunities for school-enterprise cooperation such as innovating talent training models, building internship and training bases, and building industry-university-research service platforms. It is reported that the pilot base will undertake the functional testing of hundreds of millions of chips every year, and provide more than 500 integrated circuit training for enterprises in the Economic Development Zone. At the end of December 2022, the pilot base was selected as a national vocational education teacher training base.
In the future, Chipone will continue to deepen school-enterprise cooperation, broaden the two-way communication channels between enterprises and talents, promote the complementary advantages of industry-university-research resources, and work with major universities to take multiple measures at the same time to continuously promote the all-round connection between the training of high-tech professionals and the needs of the integrated circuit industry.
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